Micro-Electronics Molding Home » Micro Molding Capabilities » Micro Mold Classifications » Micro-Electronics Molding Micro-electronics molding, within micro molding is ideal for high-volume, microscopic parts and components like sensors, lenses, and microelectronics packages. The specialized manufacturing process produces extremely small, high-precision thermoplastic parts and components with micron tolerances and features at scale. Today’s most state-of-the-art technology companies have likely relied on micro-electronics molding within the micro molding space. Micro-electronics molding specifics Lead Frame Overmold example Our micro-electronics molding process produces high-precision, yet robust components at rapid speeds, all while maintaining some of the tightest tolerances imaginable. The size of the part our clients need, the complexity of the design, and tolerances required are only the beginning. Our micro-electronics molding orders often require an insert molded or over-molded component. Our technology is capable of molding specialty resin, over, through, in, or around other materials such as metal, other plastics, fabric, flex circuits, and other delicate media all maintaining micron to half-micron tolerances. At the same time, our process is repeatable, meets rigid customer quality requirements, and each component is packaged custom to meet your manufacturing process requirements. Micro-electronics molding specifics Ultem Polyetherimide PEI Perfectly executed micro-electronics molding projects require the balance of materials handling, experience, and technology. Here is a quick overview of micro-electronics molding materials and examples. Materials We utilize a diverse palette of micro molding materials, depending on your project demands. Some examples include medical grades and implantable materials, others include high temperature (3x reflow capable) glass-filled nylons. More examples include: LCP HTN-Nylon PPS-Polysulfone PEEK Ultem Xtem Polycarbonate varieties Polyesters Full list > Component Examples This open cavity lead frame is a micro-electronics molding example. A handful of examples from past projects are components for sensors (proximity, gas, smoke, time of flight), Bluetooth antennas, hearing aid components and batteries, and overmolding flex PCB. Why Accumold? The components we produce on a daily basis are certainly repeatable in a lab, but Accumold’s micro-electronics molding process is capable of producing not only complex parts but in very high quantities. We build complete automation systems with conveyors, machine vision cameras and automated inspection. Accumold can also scale production to meet your manufacturing demands within a few weeks’ time, completing projects in the 100’s of millions of pieces per year. We are able to pull this off because we have in-house tooling and in-house automation departments that work alongside our DFM experts. There is far more to micro-electronics molding, please ask us about exceeding part design opportunities outside traditional methods or practices that typical molders would not be able to offer. We achieve what our clients may believe is impossible. Got A Tricky Question? Send Our DFM Engineers A Message. (They like the attention.) First Name* First Last Name* Last CompanyEmail* What do you need micro mold insight on?